Young's modulus and fatigue lifetime improvements by diamond size effect on electroplated Ni-diamond nanocomposite

C. S. Huang, Yu-Ting Cheng, C. J. Yeh, H. K. Liu, Wen-Syang Hsu

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Fatigue and Young's modulus characterizations have been investigated using the bending-test method on microsized cantilever-beam specimens made of electroplated Ni and Ni-diamond nanocomposites with different particle sizes (i.e. 350nm and 50nm in diameter). The experimental results show that electroplated Ni-diamond nanocomposite has slightly smaller fatigue strength than that of pure electroplated Ni due to the ductility reduction resulted by the nano-diamond particles. However, once the incorporated particle size of nano-diamond is reduced from 350nm to 50nm, it has been found that the electroplated Ni-diamond nanocomposite can have higher Young's modulus (13.6% enhancement, i.e. 178GPa) and comparable fatigue strength (∼2.4GPa) with that of pure electroplated Ni.

原文English
主出版物標題TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
頁面180-183
頁數4
DOIs
出版狀態Published - 11 12月 2009
事件TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems - Denver, CO, 美國
持續時間: 21 6月 200925 6月 2009

出版系列

名字TRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems

Conference

ConferenceTRANSDUCERS 2009 - 15th International Conference on Solid-State Sensors, Actuators and Microsystems
國家/地區美國
城市Denver, CO
期間21/06/0925/06/09

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