@inproceedings{df315ffae9954013828294c0710b3289,
title = "Yield-driven redundant power bump assignment for power network robustness",
abstract = "During package manufacturing process, open defects of power bumps may cause insufficient power supply and degrade the power network yield. This work presents a redundant power bump insertion method to ensure power integrity by considering the power bump yields. The proposed method can efficiently assign redundant bumps by accurately estimating the location of worst load yield and minimizing the amounts of redundant bumps to enhance the power network yield.",
author = "Yu-Min Lee and Lee, {Chi Han} and Zhu, {Yan Cheng}",
year = "2017",
month = feb,
day = "16",
doi = "10.1109/ASPDAC.2017.7858331",
language = "English",
series = "Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "269--274",
booktitle = "2017 22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017",
address = "United States",
note = "22nd Asia and South Pacific Design Automation Conference, ASP-DAC 2017 ; Conference date: 16-01-2017 Through 19-01-2017",
}