Wafer level batch fabrication and assembly of small form factor optical pickup head

Sheng Yi Hsiao*, Chih Chun Lee, Yi Chiu, Hsi Fu Shih, Jin-Chern Chiou, Han-Ping Shieh, Weileun Fang

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

A MEMS batch assembly process for fabricating small form factor optical pickup head is proposed to minimize the complexity of assembly. Electrical and optical components are sealed in a chamber. A silicon optical bench with a packaged laser diode and crystalline-plane mirrors is demonstrated.

原文American English
主出版物標題2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
發行者IEEE
頁面102-103
頁數2
ISBN(列印)9781424419180
DOIs
出版狀態Published - 23 10月 2008
事件2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS - Freiburg, Germany
持續時間: 11 8月 200814 8月 2008

出版系列

名字2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS

Conference

Conference2008 IEEE/LEOS International Conference on Optical MEMS and Nanophotonics, OPT MEMS
國家/地區Germany
城市Freiburg
期間11/08/0814/08/08

指紋

深入研究「Wafer level batch fabrication and assembly of small form factor optical pickup head」主題。共同形成了獨特的指紋。

引用此