Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET

Ta-Hui Wang*, C. F. Hsu, L. P. Chiang, N. K. Zous, Tien-Sheng Chao, C. Y. Chang

*此作品的通信作者

研究成果: Conference article同行評審

3 引文 斯高帕斯(Scopus)

摘要

Drain leakage current degradation at zero Vgs in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. Our result shows that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.

原文English
頁(從 - 到)209-213
頁數5
期刊Annual Proceedings - Reliability Physics (Symposium)
DOIs
出版狀態Published - 1 1月 1998
事件Proceedings of the 1998 36th IEEE International Reliability Physics Symposium - Reno, NV, USA
持續時間: 31 3月 19982 4月 1998

指紋

深入研究「Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET」主題。共同形成了獨特的指紋。

引用此