| 原文 | English |
|---|---|
| 專利號 | US 8,169,276 B2 |
| 出版狀態 | Published - 1 5月 2012 |
VERTICAL TRANSMISSION LINE STRUCTURE THAT INCLUDES BUMP ELEMENTS FOR FLIP-CHIP MOUNTING
Edward Yi Chang (Inventor), Ruey-Bing Hwang (Inventor)
研究成果: Patent
Edward Yi Chang (Inventor), Ruey-Bing Hwang (Inventor)
研究成果: Patent
| 原文 | English |
|---|---|
| 專利號 | US 8,169,276 B2 |
| 出版狀態 | Published - 1 5月 2012 |