Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging

Chia Hsin Lee, Baron Huang, Jennifer See, Xiao Liu, Yu Min Lin, Wei Lan Chiu, Chao Jung Chen, Ou Hsiang Lee, Hsiang En Ding, Ren Shin Cheng, Ang Ying Lin, Sheng Tsai Wu, Tao Chih Chang, Hsiang Hung Chang, Kuan Neng Chen^*