Versatile laser release material development for chip-first and chip-last fan-out wafer-level packaging

  • Chia Hsin Lee
  • , Baron Huang
  • , Jennifer See
  • , Xiao Liu
  • , Yu Min Lin
  • , Wei Lan Chiu
  • , Chao Jung Chen
  • , Ou Hsiang Lee
  • , Hsiang En Ding
  • , Ren Shin Cheng
  • , Ang Ying Lin
  • , Sheng Tsai Wu
  • , Tao Chih Chang
  • , Hsiang Hung Chang
  • , Kuan Neng Chen*
    • *此作品的通信作者

研究成果: Conference contribution › 同行評審

2 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering