Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Yu-Ting Cheng; W. T. Hsu; L. Lin; C. T. Nguyen; K. Najafi

doi:10.1109/MEMSYS.2001.906468

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

Yu-Ting Cheng^*, W. T. Hsu, L. Lin, C. T. Nguyen, K. Najafi

^*此作品的通信作者

電子研究所

研究成果: Paper › 同行評審

40 引文斯高帕斯（Scopus）

摘要

A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

原文	English
頁面	18-21
頁數	4
DOIs	https://doi.org/10.1109/MEMSYS.2001.906468
出版狀態	Published - 2001
事件	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) - Interlaken, 瑞士持續時間: 21 1月 2001 → 25 1月 2001

Conference

Conference	14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)
國家/地區	瑞士
城市	Interlaken
期間	21/01/01 → 25/01/01

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10.1109/MEMSYS.2001.906468

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abstract = "A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.",

author = "Yu-Ting Cheng and Hsu, {W. T.} and L. Lin and Nguyen, {C. T.} and K. Najafi",

year = "2001",

doi = "10.1109/MEMSYS.2001.906468",

language = "English",

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note = "14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001) ; Conference date: 21-01-2001 Through 25-01-2001",

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AU - Cheng, Yu-Ting

AU - Hsu, W. T.

AU - Lin, L.

AU - Nguyen, C. T.

AU - Najafi, K.

PY - 2001

Y1 - 2001

N2 - A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

AB - A vacuum package based on localized aluminum/silicon-to-glass bonding has been successfully demonstrated. With 3.4 watts heating power, ∼0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation at 25mtorr can be achieved. Folded-beam comb drive μ-resonators are encapsulated and used as pressure monitors. Long-term testing of un-annealed vacuum-packaged μ-resonators with a Q of 2500 has demonstrated stable operation after 20 weeks. A μ-resonator with Q of ∼9600 has been vacuum encapsulated and shown to be stable after 7 weeks.

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DO - 10.1109/MEMSYS.2001.906468

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EP - 21

T2 - 14th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2001)

Y2 - 21 January 2001 through 25 January 2001

ER -

Vacuum packaging technology using localized aluminum/silicon-to-glass bonding

摘要

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