Using fluorine-ion implanted a-Si layer to reduce Ni contamination and passivate the defects in NILC poly-Si

Chien Chih Chen*, Yew-Chuhg Wu

*此作品的通信作者

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

The grain boundaries which included dangling bonds in Ni-metal-induced lateral crystallization (NILC) poly-Si TFT would trap Ni and NiSi2 precipitates. This phenomenon resulted in threshold voltage shifting and lower field-effect mobility. To resolve this issue, the a-Si layer with fluorine-ion implanted was used as gettering layer to reduce Ni contamination and passivate the dangling bonds in the active layer. It was found that the F-G layer could not only reduce the Ni contamination but also passivate the defects in NILC poly-Si.

原文English
主出版物標題Thin Film Transistors 10, TFT 10
頁面161-164
頁數4
版本5
DOIs
出版狀態Published - 1 12月 2010
事件10th Symposium on Thin Film Transistor Technologies, TFT 10 - 218th ECS Meeting - Las Vegas, NV, United States
持續時間: 11 10月 201015 10月 2010

出版系列

名字ECS Transactions
號碼5
33
ISSN(列印)1938-5862
ISSN(電子)1938-6737

Conference

Conference10th Symposium on Thin Film Transistor Technologies, TFT 10 - 218th ECS Meeting
國家/地區United States
城市Las Vegas, NV
期間11/10/1015/10/10

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