Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

Hsi-Kuei Cheng, Yu-Jie Lin, Hou-Chien Chang, Kuo-Chio Liu, Ying-Lang Wang, Tzeng-Feng Liu, Chih Ming Chen

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar's morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015
原文English
頁(從 - 到)1834-1837
頁數4
期刊Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
46A
發行號5
DOIs
出版狀態Published - 五月 2015

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