Ultra-high light extraction efficiency and ultra-thin mini-LED solution by freeform surface chip scale package array

Che Hsuan Huang, Chieh Yu Kang, Shu Hsiu Chang, Chih Hao Lin, Chun Yu Lin, Tingzhu Wu*, Chin Wei Sher, Chien-Chung Lin, Po-Tsung Lee, Hao-Chung Kuo

*此作品的通信作者

研究成果: Article同行評審

21 引文 斯高帕斯(Scopus)

摘要

In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Comparing with these two mainstream types of package, the light extraction efficiency of CSP, SMD, and FDCSP are 88%, 60%, and 96%, respectively. In addition to ultra-high light extraction efficiency, because of the 160-degree bat-wing light field, FDCSP could provide a thinner and low power consumption mini-LED solution with a smaller number of LEDs than CSP and SMD light source array.

原文English
文章編號202
期刊Crystals
9
發行號4
DOIs
出版狀態Published - 4月 2019

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