Through-silicon-via-based double-side integrated microsystem for neural sensing applications

Chih Wei Chang^*, Po-Tsang Huang, Lei Chun Chou, Shang Lin Wu, Shih Wei Lee, Ching Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen Chi Lee, Chung Hsi Wu, Kuo Hua Chen, Chi Tsung Chiu, Ho Ming Tong

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