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Three-dimensional micro assembly of a hinged nickel micro device by magnetic lifting and micro resistance welding
Chun Wei Chang,
Wen-Syang Hsu
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此作品的通信作者
機械工程學系
研究成果
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4
引文 斯高帕斯(Scopus)
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Keyphrases
Three-dimensional (3D)
100%
Microdevice
100%
Magnetic Lifting
100%
Micro Resistance Welding
100%
Microassembly
100%
Beamwidth
66%
Electrothermal Actuator
66%
In Situ
33%
Actuator
33%
Thermoelectric Properties
33%
Contact Area
33%
Design Parameters
33%
Electroplating
33%
Microstructure
33%
Hinge Mechanism
33%
Bending Beam
33%
Resistivity
33%
Pressing Force
33%
Tilt Angle
33%
Assembly Method
33%
Contact Pressure
33%
Thermal Deformation
33%
Machining Process
33%
Power Input
33%
Enlargement
33%
Electrical Transmission
33%
Tilted Structures
33%
Width Design
33%
Surface Machining
33%
Welding Process
33%
Dynamic Resistance Curve
33%
Welded Joint
33%
3D Micro-assembly
33%
Engineering
Resistance Welding
100%
Actuator
100%
Beam Width
66%
Microstructure
33%
Contact Area
33%
Design Parameter
33%
Contact Pressure
33%
Thermal Deformation
33%
Welds
33%
Power Input
33%
Resistance Curve
33%
Dynamic Resistance
33%
Welding
33%
Electric Power Transmission
33%