TY - JOUR
T1 - Three-dimensional fully symmetric inductors, transformer, and balun in CMOS technology
AU - Chen, Wei-Zen
AU - Chen, Wen Hui
AU - Hsu, Kuo Ching
PY - 2007/7/1
Y1 - 2007/7/1
N2 - This paper presents novel three-dimensional (3-D) symmetric passive components, including inductors, transformers, and balun. Layout areas of these components are drastically reduced by 32% to 70%, while the symmetry of the input and the output ports is still maintained. The inductance mismatch in the 3-D transformer is less than 0.1%, and the coupling coefficient can be up to 0.77. The 3-D balun manifests less than 0.6-dB gain mismatch for 10-GHz range, and the phase error is less than 7° from 1- to 10-GHz frequency range according to measurement results. Furthermore, the self-resonant frequency (fSR) of the proposed architecture is improved by 32% to 61% in contrast to their planar counterparts. On the other hand, the quality factor is degraded by less than 2 for the sake of using lower metal layers. The distributed capacitance model is utilized to validate their superiorities in fSR. All the devices are fabricated in a generic 0.18-μ CMOS process.
AB - This paper presents novel three-dimensional (3-D) symmetric passive components, including inductors, transformers, and balun. Layout areas of these components are drastically reduced by 32% to 70%, while the symmetry of the input and the output ports is still maintained. The inductance mismatch in the 3-D transformer is less than 0.1%, and the coupling coefficient can be up to 0.77. The 3-D balun manifests less than 0.6-dB gain mismatch for 10-GHz range, and the phase error is less than 7° from 1- to 10-GHz frequency range according to measurement results. Furthermore, the self-resonant frequency (fSR) of the proposed architecture is improved by 32% to 61% in contrast to their planar counterparts. On the other hand, the quality factor is degraded by less than 2 for the sake of using lower metal layers. The distributed capacitance model is utilized to validate their superiorities in fSR. All the devices are fabricated in a generic 0.18-μ CMOS process.
KW - 3-dimensional inductor
KW - Balun
KW - Coupling coefficient
KW - Self-resonant frequency
KW - Transformer
UR - http://www.scopus.com/inward/record.url?scp=34547137892&partnerID=8YFLogxK
U2 - 10.1109/TCSI.2007.899628
DO - 10.1109/TCSI.2007.899628
M3 - Article
AN - SCOPUS:34547137892
SN - 1549-8328
VL - 54
SP - 1413
EP - 1423
JO - IEEE Transactions on Circuits and Systems I: Regular Papers
JF - IEEE Transactions on Circuits and Systems I: Regular Papers
IS - 7
ER -