THIN ALLOY FILMS FOR METALLIZATION IN MICROELECTRONIC DEVICES.

King-Ning Tu*

*此作品的通信作者

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

The so-called ″submicron structure″ is the measure of lateral and vertical dimensions of circuit units such as contacts, gates, and interconnecting lines made mostly of metallic films on semiconductors. In most thin-film multilayered structures used in present devices, each layer is typically a pure metal film. When several of them are stacked together by sequential deposition, the structure is unstable, so interdiffusion and reactions will occur between neighboring layers. The stability of multilayered structures must be improved. H is shown that the use of alloys seems to solve the instability problems.

原文English
頁(從 - 到)237-282
頁數46
期刊Treatise on Materials Science and Technology
24
DOIs
出版狀態Published - 1 1月 1982

指紋

深入研究「THIN ALLOY FILMS FOR METALLIZATION IN MICROELECTRONIC DEVICES.」主題。共同形成了獨特的指紋。

引用此