Thermal resistivity and moisture migration of soil and cable trench backfill

Albert T. Yeung, Derek V. Morris

研究成果: Conference contribution同行評審

摘要

There are many innovative applications of thermal properties of soil and backfill, such as geothermal cooling and heating systems, backfilling of high-voltage cable, etc., being developed. Therefore, there is a need to develop a better understanding of the thermal behavior of soil and backfill. The thermal resistivity and moisture migration behavior of a number of soils including those frequently used for high-voltage cable backfill have been studied in laboratory-scale and field-scale experiments, so as to evaluate their suitability as a backfill material. Thermal resistivity of small soil specimens was measured in the laboratory using a probe. Moreover, compaction mold thermal moisture migration tests were carried out for larger specimens in the laboratory. A full-scale field test was performed by means of a simulated cable installation. The results indicate in general that well-graded granular materials have the most desirable thermal behavior, and poorly graded soils (especially granular and coarse soils) have the least desirable thermal behavior, in terms of thermal resistivity and moisture migration driven by a thermal gradient.

原文English
主出版物標題GeoCongress 2012
主出版物子標題State of the Art and Practice in Geotechnical Engineering
發行者American Society of Civil Engineers (ASCE)
頁面4495-4504
頁數10
版本225 GSP
ISBN(列印)9780784412121
DOIs
出版狀態Published - 2012
事件GeoCongress 2012: State of the Art and Practice in Geotechnical Engineering - Oakland, CA, United States
持續時間: 25 3月 201229 3月 2012

出版系列

名字Geotechnical Special Publication
號碼225 GSP
ISSN(列印)0895-0563

Conference

ConferenceGeoCongress 2012: State of the Art and Practice in Geotechnical Engineering
國家/地區United States
城市Oakland, CA
期間25/03/1229/03/12

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