@inproceedings{f58798b6f38b448783b2908542113652,
title = "Thermal Pad Design Flow for Automotive Electronics",
abstract = "This work proposes an effective thermal pad (TP) design flow for automotive electronics. It contains modeling and design stages. In the modeling stage, thermal and cost functions are developed to evaluate thermal behavior and cost of TP. In the design stage, the suitable size and thermal conductivity of TP are decided to optimize these functions. From measured results, the temperature of automotive electronics can satisfy the threshold temperature and the cost can be minimized by the proposed flow. ",
keywords = "automotive electronics, thermal estimation, thermal pad design",
author = "Chen, {Guan Jia} and Chiou, {Hong Wen} and Chang, {Yu Teng} and Lee, {Yu Min}",
note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 8th IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021 ; Conference date: 15-09-2021 Through 17-09-2021",
year = "2021",
doi = "10.1109/ICCE-TW52618.2021.9603076",
language = "English",
series = "2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2021 IEEE International Conference on Consumer Electronics-Taiwan, ICCE-TW 2021",
address = "United States",
}