Thermal-driven analog placement considering device matching

Po-Hung Lin, Hongbo Zhang, Martin D.F. Wong, Yao Wen Chang

研究成果: Article同行評審

25 引文 斯高帕斯(Scopus)

摘要

With the thermal effect, improper analog placements may degrade circuit performance because the thermal impact from power devices can affect electrical characteristics of the thermally-sensitive devices. There is not much previous work that considers the desired placement configuration between power and thermally-sensitive devices for a better thermal profile to reduce the thermally-induced mismatches. This paper first introduces the properties of a desired thermal profile for better thermal matching of the matched devices. It then presents a thermal-driven analog placement methodology to achieve the desired thermal profile and to consider the best device matching under the thermal profile while satisfying the symmetry and the common-centroid constraints. Experimental results based on real analog circuits show that the proposed approach can achieve the best analog circuit performance/accuracy with the least impact due to the thermal gradient, among existing works.

原文English
文章編號5715604
頁(從 - 到)325-336
頁數12
期刊IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
30
發行號3
DOIs
出版狀態Published - 1 3月 2011

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