Thermal conductivity of silicon nanowire using landauer approach for thermoelectric applications

Ming Yi Lee*, Min Hui Chuang, Yi-Ming Li, Seiji Samukawa

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

The electronic and phononic band structure of silicon nanowires embedded in SiGeo.3 is calculated and used to investigate its effect on the thermoelectric properties by Landauer approach. The contribution from elec-Tron/hole on power factor and electronic thermal con-ductance is less than that from phonons on lattice ther-mal conductance.

原文English
主出版物標題Proceedings of 2019 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
編輯Francesco Driussi
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781728109404
DOIs
出版狀態Published - 9月 2019
事件24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019 - Udine, Italy
持續時間: 4 9月 20196 9月 2019

出版系列

名字International Conference on Simulation of Semiconductor Processes and Devices, SISPAD
2019-September

Conference

Conference24th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2019
國家/地區Italy
城市Udine
期間4/09/196/09/19

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