Thermal analysis and electrical performance of packaged AlGaN/GaN power HEMTs

Po Chien Chou, Stone Cheng, Wei-Hua Chieng, Edward Yi Chang, Hsin Ping Chou

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

This work presents thermal resistance constitution evaluation and electrical experiments for AlGaN/GaN HEMTs packaging device. The investigation of thermal resistance is based on the closed-form expression heat transfer model. Actual multi-fingers structure and thermal resistance was modeled. The Infrared thermography is utilized to observe heat distribution of the packaged GaN device by measuring the temperature of the active region in the operation. The simulation result is verified by comparing with experimental observations. The total thermal resistance is 134.42 K/W by calculation while that is 145.77 K/W by simulation. The self-heating effect under switching operation is verified by IR image. The simulation process is calibrated against measurement data of a actual device and provides good predictive results for the DC characteristics.

原文English
主出版物標題2013 IEEE 10th International Conference on Power Electronics and Drive Systems, PEDS 2013
頁面517-520
頁數4
DOIs
出版狀態Published - 1 8月 2013
事件2013 IEEE 10th International Conference on Power Electronics and Drive Systems, PEDS 2013 - Kitakyushu, Japan
持續時間: 22 4月 201325 4月 2013

出版系列

名字Proceedings of the International Conference on Power Electronics and Drive Systems

Conference

Conference2013 IEEE 10th International Conference on Power Electronics and Drive Systems, PEDS 2013
國家/地區Japan
城市Kitakyushu
期間22/04/1325/04/13

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