The investigation of interfacial and crystallographic observation in the Ni(V)/SAC/OSP Cu solder joints with high and low silver content during thermal cycling test

Christine Jill Lee, Wei Yu Chen, Tzu Ting Chou, Tae Kyu Lee, Yew-Chuhg Wu, Tao Chih Chang, Jenq Gong Duh*

*此作品的通信作者

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9 引文 斯高帕斯(Scopus)

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Physics & Astronomy

Engineering & Materials Science

Chemical Compounds