TY - GEN
T1 - The Impact of Thermal Noise in Multi-Domain Hf-based Antiferroelectric Material
T2 - 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024
AU - Luo, Sheng
AU - Zheng, Zijie
AU - Zhou, Zuopu
AU - Gong, Xiao
AU - Liang, Gengchiau
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - The deterioration of the endurance performance in the Hf-based antiferroelectric (AFE) material has been a crucial challenge in the reliability of its device applications. In this work, we propose a stochastic dynamic scheme to model the fatigue behaviors induced by thermal noise. Through the analysis of noise-induced phase transitions, we point out the impact of thermal effects on endurance, for which the mechanism is independent of defects/traps and is in good agreement with the experimental results. The complex interplay between the thermal noise and the domain dynamics provides a unique insight into the reliability and recovery strategy.
AB - The deterioration of the endurance performance in the Hf-based antiferroelectric (AFE) material has been a crucial challenge in the reliability of its device applications. In this work, we propose a stochastic dynamic scheme to model the fatigue behaviors induced by thermal noise. Through the analysis of noise-induced phase transitions, we point out the impact of thermal effects on endurance, for which the mechanism is independent of defects/traps and is in good agreement with the experimental results. The complex interplay between the thermal noise and the domain dynamics provides a unique insight into the reliability and recovery strategy.
UR - http://www.scopus.com/inward/record.url?scp=85196712487&partnerID=8YFLogxK
U2 - 10.1109/VLSITSA60681.2024.10546449
DO - 10.1109/VLSITSA60681.2024.10546449
M3 - Conference contribution
AN - SCOPUS:85196712487
T3 - 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings
BT - 2024 International VLSI Symposium on Technology, Systems and Applications, VLSI TSA 2024 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 22 April 2024 through 25 April 2024
ER -