The Heterogeneous Packaging of A 3 × 3 Mini-Led Array for Smart Contact Lens Applications

Cheng Wei Tsai, Guan Ting Yeh, Shun Hsi Hsu, Shin Ho Wu, Yu Hsuan Huang, Her-Ming Chiueh, Jin Chern Chiou*

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

This study focuses on the integration of a 3 × 3 LED array, a driver chip, and an antenna into a HEMA-based contact lens. To ensure biocompatibility and comfortable wearing, the thickness of the contact lens must be less than 200 μm. To achieve this, a flexible substrate was utilized, along with a wireless powering antenna and metal wire for interconnecting the driver chip and Mini-LED array. The system employs 920 MHz RFID technology for the power/data transmission. The chip of the lens can receive 100 μW when the RFID reader's antenna is 2 cm away, which can drive about 30 μA to the Mini-LED. Real-time control of the Mini-LED display array can be achieved by sending instructions using RFID protocol.

原文English
主出版物標題2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
發行者Institute of Electrical and Electronics Engineers Inc.
頁面449-452
頁數4
ISBN(電子)9784886864352
出版狀態Published - 2023
事件22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023 - Kyoto, 日本
持續時間: 25 6月 202329 6月 2023

出版系列

名字2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023

Conference

Conference22nd International Conference on Solid-State Sensors, Actuators and Microsystems, Transducers 2023
國家/地區日本
城市Kyoto
期間25/06/2329/06/23

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