The Effect of the P-Substrate Connection on the HBM Robustness of P-type ESD Device

Jian Hsing Lee, Chih Cherng Liao, Wen Hsin Lin, Chih Hsuan Lin, Karuna Nidhi, Yeh Ning Jou, Ke Horng Chen

研究成果: Conference contribution同行評審

摘要

Although the p-substrate connection of p-type ESD device does not have any impact on the device's It2 while connecting the p-substrate to the ground degrades the human-body model (HBM) robustness of the device significantly. From the experiment results, adding N-type buried layer (NBL) to p-type ESD device can have the device HBM robustness invariant to the p-substrate connection. Based on the T-CAD simulations, the effect of the p-substrate connection on the HBM robustness of p-type ESD device is revealed in this paper. As HBM raises up the potential of the whole region of p-type ESD device after the onset of zapping for a while and then the high potential region of the device decreases with decreasing HBM current if the p-substrate is grounded, resulting in the current crowding. On the contrary, the high potential region of p-type ESD device does not decrease with decreasing HBM current if the p-substrate is floating or NBL is added to the device, resulting in the uniform current distribution.

原文English
主出版物標題2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9798350360608
DOIs
出版狀態Published - 2024
事件2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024 - Singapore, 新加坡
持續時間: 15 7月 202418 7月 2024

出版系列

名字Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
ISSN(列印)1946-1542
ISSN(電子)1946-1550

Conference

Conference2024 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2024
國家/地區新加坡
城市Singapore
期間15/07/2418/07/24

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