The effect of folds in thin metal film electrodes used in dielectric elastomer actuators

Sze Hsien Low, Gih Keong Lau

研究成果: Conference contribution同行評審

2 引文 斯高帕斯(Scopus)

摘要

Due to high electrical conductivity, metals have been the traditional material for electrodes. However, as metal films have low fracture strains, they are not commonly used as compliant electrodes in the field of dielectric elastomer actuators and generators. We have recently demonstrated that the use of metal films as electrodes can in fact allow dielectric elastomer actuators to have large actuated area strains of more than 100%. The metal film electrodes used have a network of crumples that unfolds as it is subjected to in-plane strains. This mechanism enables the metal electrodes to have a relatively low stiffening effect on the soft dielectric elastomer and to be able to retain its low resistance despite being highly strained; the latter characteristic would facilitate in the reduction of parasitic losses in dielectric elastomer generator applications. By metalizing a highly bi-axially pre-stretched dielectric elastomer that was subsequently partially relaxed, a bi-axial compressive force was introduced into the metal films, thereby causing a network of folds to form. In this paper, we study the change in the topography of the crumpled metal electrodes as the metal films are subjected to varying extents of bi-axial compression. It was also found that the way in which the metal films fold does in fact alter the electrodes' stretchability, as manifested in the performance of the dielectric elastomer actuators using these crumpled metal films as electrodes.

原文English
主出版物標題Electroactive Polymer Actuators and Devices (EAPAD) 2013
DOIs
出版狀態Published - 2013
事件SPIE Electroactive Polymers Actuators and Devices Conference, EAPAD 2013 - San Diego, CA, 美國
持續時間: 11 3月 201314 3月 2013

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
8687
ISSN(列印)0277-786X

Conference

ConferenceSPIE Electroactive Polymers Actuators and Devices Conference, EAPAD 2013
國家/地區美國
城市San Diego, CA
期間11/03/1314/03/13

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