@inproceedings{26c9e180ec8a4839b0c746dbedb8cf95,
title = "The Effect of Electromigration and Stress Migration on NT-Cu RDLs Passivated with Titanium Dioxide",
abstract = "Due to the shrinking size of chip devices, the current density carried by redistribution layer (RDLs) increases. We used titanium dioxide (TiO2) as the passivation layer to enhance the lifetime of electro migration. The lifetime of TiO2-capped NT-Cu RDLs increased about 2 times compared to those coated with polyimide (PI). In this study, we found the mechanism of failure on NT-Cu RDLs capped with TiO2 was the electro migration-induced voiding combined with the stress migration.",
keywords = "Electromigration, Nanotwinned Cu, Redistribution layers, Stress migration",
author = "Lin, {Yi Quan} and Tang, {Ching Yu} and Hung, {Yu Wen} and Lin, {You Yi} and Chih Chen",
note = "Publisher Copyright: {\textcopyright} 2024 Japan Institute of Electronics Packaging.; 23rd International Conference on Electronics Packaging, ICEP 2024 ; Conference date: 17-04-2024 Through 20-04-2024",
year = "2024",
doi = "10.23919/ICEP61562.2024.10535554",
language = "English",
series = "2024 International Conference on Electronics Packaging, ICEP 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "155--156",
booktitle = "2024 International Conference on Electronics Packaging, ICEP 2024",
address = "美國",
}