The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage

T. C. Chang, Y. S. Mor, Po-Tsun Liu, T. M. Tsai, C. W. Chen, Y. J. Mei, S. M. Sze

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20 引文 斯高帕斯(Scopus)

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Keyphrases

Material Science

Chemical Engineering