The Correlations between ESD and TLP in Large Array Devices

  • Shao Chang Huang
  • , Ching Ho Li
  • , Li Fan Chen
  • , Chun Chih Chen
  • , Ting You Lin
  • , Kai Chieh Hsu
  • , Gong Kai Lin
  • , Jian Hsing Lee
  • , Yu Yung Kao
  • , Ke-Horng Chen

研究成果: Conference contribution同行評審

4 引文 斯高帕斯(Scopus)

摘要

Transmission Line Pulse (TLP) is often applied for Electrostatic Discharge (ESD) devices' characteristics researches. It indicates the devices' triggering-on behaviors, holding performances and thermal run-away results. In normal cases, the thermal run-away data should correlate to ESD [1]. However, the non-correlations between TLP and ESD can be observed in the gate driving circuits [2], silicide devices [3] and poly fuses [4]. In this paper, analyses for the relations between ESD and TLP are taken into discussions for large array devices (LAD).

原文English
主出版物標題2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁數2
ISBN(電子)9781728173993
DOIs
出版狀態Published - 28 9月 2020
事件7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020 - Taoyuan, 台灣
持續時間: 28 9月 202030 9月 2020

出版系列

名字2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020

Conference

Conference7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
國家/地區台灣
城市Taoyuan
期間28/09/2030/09/20

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