The Correlations between ESD and TLP in Large Array Devices

Shao Chang Huang, Ching Ho Li, Li Fan Chen, Chun Chih Chen, Ting You Lin, Kai Chieh Hsu, Gong Kai Lin, Jian Hsing Lee, Yu Yung Kao, Ke-Horng Chen

研究成果: Conference contribution同行評審

3 引文 斯高帕斯(Scopus)

摘要

Transmission Line Pulse (TLP) is often applied for Electrostatic Discharge (ESD) devices' characteristics researches. It indicates the devices' triggering-on behaviors, holding performances and thermal run-away results. In normal cases, the thermal run-away data should correlate to ESD [1]. However, the non-correlations between TLP and ESD can be observed in the gate driving circuits [2], silicide devices [3] and poly fuses [4]. In this paper, analyses for the relations between ESD and TLP are taken into discussions for large array devices (LAD).

原文English
主出版物標題2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁數2
ISBN(電子)9781728173993
DOIs
出版狀態Published - 28 9月 2020
事件7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020 - Taoyuan, Taiwan
持續時間: 28 9月 202030 9月 2020

出版系列

名字2020 IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020

Conference

Conference7th IEEE International Conference on Consumer Electronics - Taiwan, ICCE-Taiwan 2020
國家/地區Taiwan
城市Taoyuan
期間28/09/2030/09/20

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