Test structures to verify ESD robustness of on-glass devices in LTPS technology

Ming-Dou Ker*, Chih Kang Deng, Sheng Chieh Yang, Yaw Ming Tasi

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    摘要

    Different test structures used to investigate the electrostatic discharge (ESD) robustness of on-glass device in Low Temperature Poly-Si (LTPS) process are proposed in this paper. The transmission line pulse generator (TLPG) is used to monitor the I-V behaviors of on-glass devices in the high-current region, and to evaluate the robustness of those LTPS devices during ESD stress condition. Finally, a successful ESD protection design with P + -i-N + diodes and a VDD-to-VSS ESD clamp circuit integrated on a LCD panel has been demonstrated with a machine-model (MM) ESD level of up to 275 V, whereas the traditional one only can sustain 100 V MM ESD stress.

    原文English
    頁面13-17
    頁數5
    DOIs
    出版狀態Published - 3月 2004
    事件Proceedings of the 2004 International Conference on Microelectronic Test Structures (ICMTS 2004) - Awaji, 日本
    持續時間: 22 3月 200425 3月 2004

    Conference

    ConferenceProceedings of the 2004 International Conference on Microelectronic Test Structures (ICMTS 2004)
    國家/地區日本
    城市Awaji
    期間22/03/0425/03/04

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