Test structure and verification on the MOSFET under bond pad for area-efficient I/O layout in high-pin-count SOC IC's

Ming-Dou Ker*, Jeng Jie Peng, Hsin Chin Jiang

*此作品的通信作者

    研究成果: Paper同行評審

    1 引文 斯高帕斯(Scopus)

    摘要

    For saving the layout area of I/O cells in SOC chips, a test chip with large size NMOS devices placed under bond pads has been fabricated in 0.35-μm 1P4M 3.3V CMOS process for verification. The bond pads had been drawn with different layout patterns on the inter-layer metals to investigate the impact of bonding stress on the active devices under the pads. The measurement results, including thermal shock and temperature cycling tests, show that there are only little variations between devices under bond pads and devices beside bond pads. This discovery can be applied to save layout area for on-chip ESD protection devices or I/O devices of IC products, especially for the high-pin-count SOC IC's.

    原文English
    頁面161-166
    頁數6
    DOIs
    出版狀態Published - 3月 2003
    事件IEEE International Conference on Microelectronic Test Structures - Monterey, CA, United States
    持續時間: 17 3月 200320 3月 2003

    Conference

    ConferenceIEEE International Conference on Microelectronic Test Structures
    國家/地區United States
    城市Monterey, CA
    期間17/03/0320/03/03

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