TY - JOUR
T1 - Temperature tracking and management with number-limited thermal sensors for thermal-aware NoC systems
AU - Chen, Kun Chih
AU - Tang, Hsueh Wen
AU - Liao, Yuan Hao
AU - Yang, Yueh Chi
N1 - Publisher Copyright:
© 2001-2012 IEEE.
PY - 2020/11/1
Y1 - 2020/11/1
N2 - As the complexity of multicore system grows with respect to the technology development, the Network-on-Chip (NoC) provides flexible and scalable interconnection for the multicore systems. However, as the complexity of the network increases, the large workload diversity and the time-varying workload distribution result in large power density, which leads to severer thermal problems and makes the temperature distribution of the system become time-varying. To prevent the multicore systems from overheating, in a practical way, many thermal sensors are embedded in the system. However, due to the manufacturing cost constraints, it is not a viable option to involve a massive number of embedded thermal sensors. Therefore, searching for the appropriate locations in offline design phase to allocate the number-limited thermal sensors, which will be used to sense the time-varying system temperature behavior at runtime, is a design challenge. On the other hand, full-chip temperature distribution tracking based on the restricted temperature sensing information affects the efficiency of the involved temperature management. In this paper, we first present a novel thermal sensor allocation methodology by considering the time-varying temperature behavior on the chip according to different applications. Besides, a linear-regression-based reconstruction algorithm is proposed to estimate the full-chip temperature distribution according to the number-limited thermal sensing results. At last, a framework of temperature management with restricted temperature sensing information is introduced. Compared with the conventional methods, the proposed approach can reduce 28% to 92% average error of full-chip temperature estimation, which helps to improve the average system throughput by 60% to 70%.
AB - As the complexity of multicore system grows with respect to the technology development, the Network-on-Chip (NoC) provides flexible and scalable interconnection for the multicore systems. However, as the complexity of the network increases, the large workload diversity and the time-varying workload distribution result in large power density, which leads to severer thermal problems and makes the temperature distribution of the system become time-varying. To prevent the multicore systems from overheating, in a practical way, many thermal sensors are embedded in the system. However, due to the manufacturing cost constraints, it is not a viable option to involve a massive number of embedded thermal sensors. Therefore, searching for the appropriate locations in offline design phase to allocate the number-limited thermal sensors, which will be used to sense the time-varying system temperature behavior at runtime, is a design challenge. On the other hand, full-chip temperature distribution tracking based on the restricted temperature sensing information affects the efficiency of the involved temperature management. In this paper, we first present a novel thermal sensor allocation methodology by considering the time-varying temperature behavior on the chip according to different applications. Besides, a linear-regression-based reconstruction algorithm is proposed to estimate the full-chip temperature distribution according to the number-limited thermal sensing results. At last, a framework of temperature management with restricted temperature sensing information is introduced. Compared with the conventional methods, the proposed approach can reduce 28% to 92% average error of full-chip temperature estimation, which helps to improve the average system throughput by 60% to 70%.
KW - dynamic thermal management
KW - network-on-chip (NoC)
KW - temperature tracking
KW - Thermal sensor allocation
UR - http://www.scopus.com/inward/record.url?scp=85092512712&partnerID=8YFLogxK
U2 - 10.1109/JSEN.2020.3003657
DO - 10.1109/JSEN.2020.3003657
M3 - Article
AN - SCOPUS:85092512712
SN - 1530-437X
VL - 20
SP - 13018
EP - 13028
JO - IEEE Sensors Journal
JF - IEEE Sensors Journal
IS - 21
M1 - 9121283
ER -