Tailoring thermopower of single-molecular junctions by temperature-induced surface reconstruction

Bailey C. Hsu*, Chiung-Yuan Lin, Yau Shian Hsieh, Yu-Chang Chen

*此作品的通信作者

研究成果: Article同行評審

12 引文 斯高帕斯(Scopus)

摘要

Recent experiments revealed that surface reconstruction occurs at around 300-400K in the interface of C60 adsorbed on Cu(111) substrate by scanning tunneling microscope techniques. To understand effects of such reconstruction on thermopower, we investigate the Seebeck coefficients of C 60 single-molecular junctions without and with surface reconstruction as a function of temperature at different tip-to-molecule heights from first-principles. Our calculations show that surface reconstruction can enhance or suppress Seebeck coefficients according to junctions at different tip heights. We further observe that the Seebeck coefficient of the junction at d = 3.4 Å may change from p- to n-type under surface reconstruction.

原文English
文章編號243103
期刊Applied Physics Letters
101
發行號24
DOIs
出版狀態Published - 10 12月 2012

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