TY - GEN
T1 - Surface Condition Optimization for Low Temperature Oxide Bonding in 3D Integration
AU - Hung, Tzu Heng
AU - Chen, Kuan Neng
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - 3D integration has become extremely significant while devices keep shrinking the size and minimizing power consumption. At the same time, heterogeneous integration based on 3D integration brings more and more opportunities in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together. Since 3D integration can be treated as a candidate to extend Moore's Law and a solution to fulfill the concept of "More than Moore". Key technologies of 3D integration are the key to the success. Among the key technologies, oxide bonding can effectively enhance the density of stacking and attract a lot of attention recently.In this invited talk, research results of low temperature oxide bonding of 3D integration will be reviewed and discussed. In order to achieve the best oxide bonding quality, surface condition optimization including the surface roughness and surface oxidation needs to be investigated. With development of oxide bonding technologies and demonstrations, 3D integration shows strong feasibility in next-generation electronic applications. This talk will also present the current oxide bonding advances, as well as current material development.
AB - 3D integration has become extremely significant while devices keep shrinking the size and minimizing power consumption. At the same time, heterogeneous integration based on 3D integration brings more and more opportunities in current electronic products and applications because of their flexibility and ability to integrate different substrates, functions, devices, and products together. Since 3D integration can be treated as a candidate to extend Moore's Law and a solution to fulfill the concept of "More than Moore". Key technologies of 3D integration are the key to the success. Among the key technologies, oxide bonding can effectively enhance the density of stacking and attract a lot of attention recently.In this invited talk, research results of low temperature oxide bonding of 3D integration will be reviewed and discussed. In order to achieve the best oxide bonding quality, surface condition optimization including the surface roughness and surface oxidation needs to be investigated. With development of oxide bonding technologies and demonstrations, 3D integration shows strong feasibility in next-generation electronic applications. This talk will also present the current oxide bonding advances, as well as current material development.
UR - http://www.scopus.com/inward/record.url?scp=85143982835&partnerID=8YFLogxK
U2 - 10.1109/ICSICT55466.2022.9963416
DO - 10.1109/ICSICT55466.2022.9963416
M3 - Conference contribution
AN - SCOPUS:85143982835
T3 - Proceedings of 2022 IEEE 16th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022
BT - Proceedings of 2022 IEEE 16th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022
A2 - Ye, Fan
A2 - Tang, Ting-Ao
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 16th IEEE International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2022
Y2 - 25 October 2022 through 28 October 2022
ER -