Super-hydrophobic polymer structure for fluidic selfassembly process

C. C. Chiang, Ray-Hua Horng*, G. B. Lin, D. S. Wuu

*此作品的通信作者

研究成果: Paper同行評審

摘要

This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.

原文English
頁面286-289
頁數4
出版狀態Published - 1 十二月 2008
事件5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008 - Snowbird, UT, United States
持續時間: 22 四月 200825 四月 2008

Conference

Conference5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008
國家/地區United States
城市Snowbird, UT
期間22/04/0825/04/08

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