This study provides a super-hydrophobic patterned polymer structure for fluidic self-assembly process taking insights from the mechanism of lotus effect. By controlling the hydrophobicity of the polymer structure, the solder dipped process can be easily performed on plastic substrate. Beside the binding sites, no solder was coated on the plastic substrate. The contact angle of water on flat SU-8 is just 69°. The contact angle can be increased to 144° by patterning the SU-8. This patterned SU-8 structure ensures that the solder remains on the binding sites throughout the self-assembly process submerged in acidic ethylene glycol. The advantage of super-hydrophobic SU-8 patterns used in fluidic self-assembly process is the combination of geometrical shape recognition and surface energy modification.
|出版狀態||Published - 1 十二月 2008|
|事件||5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008 - Snowbird, UT, United States|
持續時間: 22 四月 2008 → 25 四月 2008
|Conference||5th Conference on Foundations of Nanoscience: Self-Assembled Architectures and Devices, FNANO 2008|
|期間||22/04/08 → 25/04/08|