Study on the effect of electron beam curing on low-K porous organosilicate glass (OSG) material

T. C. Chang*, T. M. Tsai, Po-Tsun Liu, C. W. Chen, Tseung-Yuen Tseng

*此作品的通信作者

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18 引文 斯高帕斯(Scopus)

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Keyphrases

Material Science

Engineering