Study of self-assembly technology for 3D integration applications

Keyphrases

• 3D Integration 100%
• Alignment Method 100%
• Self-assembly Technology 100%
• Integrated Application 100%
• Surface Quality 100%
• Self-assembled Monolayer 50%
• Self-aligned 50%
• Chip Size 50%
• Bonding Technology 50%
• Heating Time 50%
• Alignment Accuracy 50%
• Hydrophobic Film 50%
• Good Design 50%
• Misalignment 50%
• Self-alignment 50%
• Dip Coating 50%
• Experimental Parameters 50%
• Multi-chip 50%
• Hydrophobic Materials 50%
• Chip Shape 50%
• Self-assembled Film 50%
• Coating Time 50%
• Hydrophilic Substrate 50%
• Hydrophilic Materials 50%
• Liquid Surface Tension 50%
• Hydrophobic Substrates 50%
• Wafer Stacking 50%

Material Science

• Self Assembly 100%
• Self Assembled Monolayer 100%
• Film 100%
• Surface Property 100%
• Surface Tension 50%

Engineering

• Hydrophobic 100%
• Self-Assembled Monolayers 66%
• Surface Quality 66%
• Bonding Technology 33%
• Good Design 33%
• Experimental Parameter 33%
• Heating Time 33%
• Dip Coating 33%