Study of self-assembly technology for 3D integration applications

Hsiao Chun Chang, Cheng Han Fan, Yi-Chia Chou, Kuan-Neng Chen

研究成果: Conference contribution同行評審

摘要

In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality of hydrophobic film with self-assembled monolayers (SAMs) based on self-assembled mechanism strongly affects the performance of alignment. The surface quality of SAMs film which depends on experimental parameters such as dip-coating time and heating time is critical to determine the accuracy of alignment. Moreover, the chip shape and size also have an impact on the alignment accuracy. By improving the misalignment, a good design by the self-assembled mechanism for the self-alignment method can be applied in the bonding technology.

原文English
主出版物標題2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面237-240
頁數4
ISBN(電子)9781467383561
DOIs
出版狀態Published - 23 12月 2015
事件10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, 台灣
持續時間: 21 10月 201523 10月 2015

出版系列

名字2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Conference

Conference10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
國家/地區台灣
城市Taipei
期間21/10/1523/10/15

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