Standard 0.18um 1P6M CMOS IC foundry flow for accelerometer, analog readout circuit and wafer level capping package integration

C. J. Huang*, C. S. Chen, K. A. Wen, Y. T. Cheng, J. Y. Chen, C. S. Chang, W. C. Chou

*此作品的通信作者

    研究成果: Conference contribution同行評審

    4 引文 斯高帕斯(Scopus)

    摘要

    The first standard CMOS IC foundry flow is presented for the monolithic integration of MEMS sensor, analog readout circuit and wafer level capping on standard 0.18um 1P6M technology. The sensor and circuit parts are fabricated at first on the same 8'' substrate using a standard 0.18um 1P6M CMOS process. The sensor part is then micromachined and released by a foundry-based post-CMOS DRIE process followed by wafer level capping. The test vehicle for the proposed integration flow contains a single-axial accelerometer, analog readout circuit with input common-mode feedback and QFN64 package. The measurement results show that the whole system can have 206mV/g of sensitivity and output noise is less than 250μg/√Hz. The proposed methodology has led a promising way for integrating MEMS, IC and package in a conventional IC foundry manufacturing flow.

    原文English
    主出版物標題IEEE Sensors 2011 Conference, SENSORS 2011
    頁面750-753
    頁數4
    DOIs
    出版狀態Published - 2011
    事件10th IEEE SENSORS Conference 2011, SENSORS 2011 - Limerick, Ireland
    持續時間: 28 10月 201131 10月 2011

    出版系列

    名字Proceedings of IEEE Sensors

    Conference

    Conference10th IEEE SENSORS Conference 2011, SENSORS 2011
    國家/地區Ireland
    城市Limerick
    期間28/10/1131/10/11

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