Sputter-cleaning of an aluminum alloy using a thermionically assisted triode plasma system

Keyphrases

• Plasma System 100%
• Triode 100%
• Aluminum Alloy 100%
• Sputter Cleaning 100%
• Diode 60%
• Cleaning Methods 40%
• Secondary Electron Yield 40%
• Cathode Current 40%
• Reactive Sputtering 20%
• Ion Bombardment 20%
• High Bias 20%
• Low Bias 20%
• Ar Plasma 20%
• Surface States 20%
• Cleaning Efficiency 20%
• Rough Surface 20%
• Aluminum Metal 20%
• High Working Pressure 20%
• High-energy Particles 20%
• AA6061 20%
• Particle Bombardment 20%
• Surface Removal 20%
• Oxide Compounds 20%
• Modified Mathematical Model 20%
• Current-time Curve 20%

Engineering

• Plasma System 100%
• Secondary Electrons 100%
• Nanoscale 50%
• Ion Implantation 50%
• Ar Plasma 50%
• Surface State 50%
• Reactive Sputtering 50%
• Aluminum Metal 50%
• Bombardment 50%
• Mathematical Model 50%

Physics

• Triode 100%
• Plasma System 100%
• Nanoscale 20%
• Mathematical Model 20%
• Blood Plasma 20%