Source-side engineering to increase holding voltage of LDMOS in a O.5-m 16-V BCD technology to avoid latch-up failure

Wen Yi Chen*, Ming-Dou Ker, Yeh Ning Jou, Yeh Jen Huang, Geeng Lih Lin

*此作品的通信作者

    研究成果: Conference contribution同行評審

    16 引文 斯高帕斯(Scopus)

    摘要

    To avoid latch-up failure in high voltage integrated circuits, a source-side engineering technique for on-chip ESD protection nLDMOS is proposed in this work. Experimental results have been verified in a O.5-μm 16-V bipolar CMOS DMOS technology. Measurement results from transmission-line-pulsing system show that the proposed source-side engineering method can effectively increase the holding voltage of the nLDMOS from 10.5V to 16.2V. Transient-induced latch-up tests show that the proposed source-side engineering technique significantly improves the latch-up immunity of nLDMOS in on-chip ESD protection circuit

    原文English
    主出版物標題Proceedings of the 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
    頁面41-44
    頁數4
    DOIs
    出版狀態Published - 16 11月 2009
    事件2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009 - Suzhou, China
    持續時間: 6 7月 200910 7月 2009

    出版系列

    名字Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

    Conference

    Conference2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2009
    國家/地區China
    城市Suzhou
    期間6/07/0910/07/09

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