TY - GEN
T1 - Simulations of electric field distributions by the susceptor-coupling effects for 2.45GHz microwave inside microwave chamber
AU - Hsueh, Fu Kuo
AU - Chang, Chih Chen
AU - Huang, Kun Ping
AU - Lee, Yao Jen
AU - Wu, Wen Fa
AU - Chao, Tien-Sheng
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2015/8/25
Y1 - 2015/8/25
N2 - Microwave annealing were able for the applications of dopant activation[1,2] and silicidation[3] of the nano-scaled transistors, However, during conventional fixed-frequency microwave heating, standing wave patterns are formed in the microwave processing chamber resulting in nodes and antinodes over the processing area. This non-uniform energy distribution in turn results in non-uniform heating, commonly observed in the kitchen microwave oven. Coupling effects to improve the uniformity and dopant activation efficiency by fixed-frequency microwave annealing process was investigated[4]. Through the aid of susceptors, the uniformity of Rs and dopant activation efficiency could be improved.
AB - Microwave annealing were able for the applications of dopant activation[1,2] and silicidation[3] of the nano-scaled transistors, However, during conventional fixed-frequency microwave heating, standing wave patterns are formed in the microwave processing chamber resulting in nodes and antinodes over the processing area. This non-uniform energy distribution in turn results in non-uniform heating, commonly observed in the kitchen microwave oven. Coupling effects to improve the uniformity and dopant activation efficiency by fixed-frequency microwave annealing process was investigated[4]. Through the aid of susceptors, the uniformity of Rs and dopant activation efficiency could be improved.
UR - http://www.scopus.com/inward/record.url?scp=84949759797&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2015.7224422
DO - 10.1109/IPFA.2015.7224422
M3 - Conference contribution
AN - SCOPUS:84949759797
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
SP - 385
EP - 388
BT - Proceedings of the 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2015
Y2 - 29 June 2015 through 2 July 2015
ER -