Silicide-caused anomalous reverse current-voltage characteristics of CoSi2 shallow p+n junctions

M. H. Juang*, C. T. Lin, Huang-Chung Cheng


研究成果: Article同行評審


Silicided shallow p+n junctions formed by BF2+ implantation into thin Co films on Si substrates to a low dosage (5 × 1014 cm-1) and subsequent rapid thermal annealing (RTA) or conventional furnace annealing (CFA) are used to show the impact of silicides on junction characteristics. CFA results in a lower leakage than RTA at a low bias as 5 V at high temperatures attributable to longer annealing time. All the diodes made by RTA exhibit a hard-breakdown behavior. For CFA 700°C annealing, however, an anomalously poor reverse I-V behavior indicative of athermal emission is found at high bias. In addition, the 800°C-formed diodes and the CFA-treated 1 × 1016 cm-2 implanted samples show good reverse characteristics even at high bias. As a result, annealing conditions should be properly chosen to reduce the impact of silicides on shallow junctions.

頁(從 - 到)101-103
期刊Solid State Electronics
出版狀態Published - 1 一月 1995


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