Selective sensor placement for cost-effective online aging monitoring and resilience

Hao Chun Chang, Li An Huang, Kai Chiang Wu*, Yu Guang Chen

*此作品的通信作者

研究成果: Conference contribution同行評審

摘要

Aggressive technology scaling trends, such as thinner gate oxide without proportional downscaling of supply voltage, aggravate the aging impact and thus necessitate an aging-aware reliability verification and optimization framework during early design stages. In this paper, we propose a novel in-situ sensing strategy based on deploying transition detectors (TDs), for on-chip aging monitoring and resilience. Transformed into the set cover problem and then formulated into maximum satisfiability, the proposed problem of TD/sensor placement can be solved efficiently. Experimental results show that, by introducing at most 2.2% area overhead (for TD/sensor placement), the aging behavior of a target circuit can be effectively monitored, and the correctness of its functionality can be perfectly guaranteed with an average of 77% aging resilience achieved. In other words, with 2.2% area overhead, potential aging-induced timing errors can be detected and then eliminated, while achieving 77% recovery from aging-induced performance degradation.

原文English
主出版物標題ISPD 2020 - Proceedings of the 2020 International Symposium on Physical Design
發行者Association for Computing Machinery
頁面95-102
頁數8
ISBN(電子)9781450370912
DOIs
出版狀態Published - 20 9月 2020
事件23rd International Symposium on Physical Design, ISPD 2020 - Taipei, Taiwan
持續時間: 29 3月 20201 4月 2020

出版系列

名字Proceedings of the International Symposium on Physical Design

Conference

Conference23rd International Symposium on Physical Design, ISPD 2020
國家/地區Taiwan
城市Taipei
期間29/03/201/04/20

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