TY - JOUR
T1 - SCR device fabricated with dummy-gate structure to improve turn-on speed for effective ESD protection in CMOS technology
AU - Ker, Ming-Dou
AU - Hsu, Kuo Chun
PY - 2005/5/1
Y1 - 2005/5/1
N2 - Turn-on speed is the main concern for an on-chip electrostatic discharge (ESD) protection device, especially in the nanoscale CMOS processes with ultrathin gate oxide. A novel dummy-gate-blocking silicon-controlled rectifier (SCR) device employing a substrate-triggered technique is proposed to improve the turn-on speed of an SCR device for using in an on-chip ESD protection circuit to effectively protect the much thinner gate oxide. The fabrication of the proposed SCR device with dummy-gate structure is fully process-compatible with general CMOS process, without using an extra mask layer or adding process steps. From the experimental results in a 0.25-μm CMOS process with a gate-oxide thickness of ∼ 50 Å, the switching voltage, turn-on speed, turn-on resistance, and charged-device-model ESD levels of the SCR device with dummy-gate structure have been greatly improved, as compared to the normal SCR with shallow trench isolation structure.
AB - Turn-on speed is the main concern for an on-chip electrostatic discharge (ESD) protection device, especially in the nanoscale CMOS processes with ultrathin gate oxide. A novel dummy-gate-blocking silicon-controlled rectifier (SCR) device employing a substrate-triggered technique is proposed to improve the turn-on speed of an SCR device for using in an on-chip ESD protection circuit to effectively protect the much thinner gate oxide. The fabrication of the proposed SCR device with dummy-gate structure is fully process-compatible with general CMOS process, without using an extra mask layer or adding process steps. From the experimental results in a 0.25-μm CMOS process with a gate-oxide thickness of ∼ 50 Å, the switching voltage, turn-on speed, turn-on resistance, and charged-device-model ESD levels of the SCR device with dummy-gate structure have been greatly improved, as compared to the normal SCR with shallow trench isolation structure.
KW - Charged device model (CDM)
KW - Dummy gate
KW - Electrostatic discharge (ESD)
KW - Silicon-controlled rectifier (SCR)
UR - http://www.scopus.com/inward/record.url?scp=19544378180&partnerID=8YFLogxK
U2 - 10.1109/TSM.2005.845112
DO - 10.1109/TSM.2005.845112
M3 - Article
AN - SCOPUS:19544378180
SN - 0894-6507
VL - 18
SP - 320
EP - 327
JO - IEEE Transactions on Semiconductor Manufacturing
JF - IEEE Transactions on Semiconductor Manufacturing
IS - 2
ER -