Schottky-Embedded Isolation Ring to Improve Latch-Up Immunity between HV and LV Circuits in a 0.18 μm BCD Technology

Zi Hong Jiang, Ming Dou Ker*

*此作品的通信作者

研究成果: Article › 同行評審

3 引文 斯高帕斯（Scopus）

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Keyphrases

Engineering

Medicine and Dentistry