Sacrificial mold embossing for high density, high aspect ratio micro/nano structures

Chunmeng Lu*, David Grewell, Avraham Benator, L. James Lee

*此作品的通信作者

研究成果: Paper同行評審

摘要

An unconventional embossing method is evaluated in which de-embossing is avoided to prevent the deformation or damage of the polymer microstructure on the substrate due to one or more of the following issues involved in hot embossing process: higher feature density, higher aspect ratio, bad surface quality and under-cuts. In this study, a PDMS mold is used to transfer a SU-8 structure to a water-soluble polymeric stamp under low pressure and low temperature, which is used as the rigid tool in the following hot embossing and can be reused by being dissolved in water, an environmentally benign solvent. This method has potential uses in the replication of high aspect ratio microstructure on polymeric materials that cannot be easily achieved using other methods.

原文English
頁面2561-2565
頁數5
出版狀態Published - 2006
事件Society of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006 - Charlotte, NC, United States
持續時間: 7 5月 200611 5月 2006

Conference

ConferenceSociety of Plastics Engineers Annual Technical Conference 2006, ANTEC 2006
國家/地區United States
城市Charlotte, NC
期間7/05/0611/05/06

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