RF-interconnect for future inter- and intra-ULSI communications

Mau-Chung Chang*, Hyunchol Shin, Liyang Zhang

*此作品的通信作者

    研究成果: Conference article同行評審

    4 引文 斯高帕斯(Scopus)

    摘要

    Future ULSI interconnect system demands extremely high data rate (up to 100Gbps/channel or 20Tbps/chip) as well as multi-I/O service, re-configurable and fault-tolerant computing/processing architecture and total compatibility with the mainstream silicon CMOS and MCM technologies. In this paper, we present a novel RF-interconnect system that promises to meet all of those system needs. The intended "active" RF-interconnect is based on principles of near-field capacitive coupling, low-loss microwave signal transmission and modern multiple-access algorithms (such as CDMA and FDMA) for shared transmission medium. We will address issues relevant to RF-interconnect system design and discuss its advantages in speed, signal integrity and channel reconfiguration. As a proof of concept, we have realized on-chip 2×2 CDMA-interconnect system and FDMA/CDMA combined RF-interconnects in 0.18μm CMOS with complete functions of signal coupling, transmission and channel reconfiguration at the clock speed of fclk=2.8GHz and 5GHz RF carrier.

    原文English
    頁(從 - 到)537-540
    頁數4
    期刊Technical Digest - International Electron Devices Meeting
    DOIs
    出版狀態Published - 12月 2001
    事件IEEE International Electron Devices Meeting IEDM 2001 - Washington, DC, United States
    持續時間: 2 12月 20015 12月 2001

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