Reshaping System Design in 3D Integration: Perspectives and Challenges

Hung Ming Chen, Chu Wen Ho, Shih Hsien Wu, Wei Lu, Po Tsang Huang, Hao Ju Chang, Chien Nan Jimmy Liu

研究成果: Conference contribution同行評審

摘要

In this paper, we depict modern system design methodologies via 3D integration along with the advance of packaging, considering system prototyping, interconnecting, and physical implementation. The corresponding challenges are presented as well.

原文English
主出版物標題ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design
發行者Association for Computing Machinery
頁面71-77
頁數7
ISBN(電子)9781450399784
DOIs
出版狀態Published - 26 3月 2023
事件32nd ACM International Symposium on Physical Design, ISPD 2023 - Virtual, Online, United States
持續時間: 26 3月 202329 3月 2023

出版系列

名字Proceedings of the International Symposium on Physical Design

Conference

Conference32nd ACM International Symposium on Physical Design, ISPD 2023
國家/地區United States
城市Virtual, Online
期間26/03/2329/03/23

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