摘要
This article reviews reliability phenomena in thin silicon dioxide. We discuss a comprehensive framework for evaluating measured SiO2 breakdown data which enables assurance of built-in oxide reliability for scaled MOS technologies. Promising technological improvements for improving SiO 2 reliability are also reviewed. We discuss an integrative view for explaining the many diverse observations about the process of oxide wear-out and failure.
原文 | English |
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文章編號 | 002 |
頁(從 - 到) | 989-1004 |
頁數 | 16 |
期刊 | Semiconductor Science and Technology |
卷 | 9 |
發行號 | 5 |
DOIs | |
出版狀態 | Published - 1 12月 1994 |