Reliability of high power semiconductor lasers on bonding and mounting design

Yu Chen Chen, Kuo-Jui Lin

研究成果: Conference contribution同行評審

1 引文 斯高帕斯(Scopus)

摘要

Reliability of high-power semiconductor lasers can be underestimated because of imperfect bonding and improper mounting. The C-mount package of Cu material is replaced with CuW material and high power laser chips are bonded above without AlN submount. For the burn-in test, liquid-metal alloy is applied between C-mount and heatsink to improve thermal contact. The estimated lifetime of 4 W, 808 nm lasers is therefore greatly increased to over 3600 hours.

原文English
主出版物標題2015 Optoelectronics Global Conference, OGC 2015
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781467377324
DOIs
出版狀態Published - 29 8月 2015
事件Optoelectronics Global Conference, OGC 2015 - Shenzhen, China
持續時間: 29 8月 201531 8月 2015

出版系列

名字2015 Optoelectronics Global Conference, OGC 2015

Conference

ConferenceOptoelectronics Global Conference, OGC 2015
國家/地區China
城市Shenzhen
期間29/08/1531/08/15

指紋

深入研究「Reliability of high power semiconductor lasers on bonding and mounting design」主題。共同形成了獨特的指紋。

引用此